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1

Simulation of temperature distribution in the oriented silicon steel coil in the heating stage of annealing process

Xia, Tian, Xiang, Zhidong, He, Zhu, Hu, Shoutian, Luo, Zhonghan

Journal:

Applied Thermal Engineering

Year:

2019

Language:

english

File:

PDF, 2.94 MB

english, 2019

2

Experimental investigation on damage mechanisms and buckling behaviors of thin composite laminates in compression after impact

Wang, Xin, Huang, Jun, Tan, Riming, Su, Yuru, Guan, Zhidong, Guo, Xia

Journal:

Composite Structures

Year:

2021

File:

PDF, 4.05 MB

2021

3

Impact resistance and damage tolerance of scarf-repaired composite structures: An experimental investigation

Guo, Xia, Li, Zengshan, Nie, Hengchang, He, Wei, Guan, Zhidong

Journal:

Polymer Composites

Year:

2016

Language:

english

File:

PDF, 2.16 MB

english, 2016

4

Fabrication of a flexible capacitor sensor with surface-fabric-structured conductive silicon rubber

Gao, Mu, Xia, Zhidong, Wang, Xuelong, Wang, Jinshu, Huang, Pei

Journal:

Sensors and Actuators A: Physical

Year:

2019

Language:

english

File:

PDF, 2.02 MB

english, 2019

5

Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints

Yaowu Shi, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2010

Language:

english

File:

PDF, 314 KB

english, 2010

6

Lead-free solders with rare earth additions

Fu Guo, Mengke Zhao, Zhidong Xia, Yongping Lei, Xiaoyan Li, Yaowu Shi

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2009

Language:

english

File:

PDF, 620 KB

english, 2009

7

Extensible Multi-Input Synchronous Electronic Charge Extraction Circuit Based on Triple Stack Resonance for Piezoelectric and Thermoelectric Energy Harvesting

wang, xiudeng, Xia, Yinshui, Shi, Ge, Xia, Huakang, Ye, Yidie, chen, zhidong

Journal:

IEEE Transactions on Industrial Electronics

Year:

2020

File:

PDF, 1.70 MB

2020

8

Process Factors and Edgewise Compressive Properties of Scarf-repaired Honeycomb Sandwich Structures

Liu, Sui, Guan, Zhidong, Guo, Xia, Sun, Kai, Kong, Jiaoyue, Yan, Dongxiu

Journal:

Applied Composite Materials

Year:

2014

Language:

english

File:

PDF, 980 KB

english, 2014

9

Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints

Ning Zhang, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2009

Language:

english

File:

PDF, 640 KB

english, 2009

10

Development of online monitor for substation 10 kV MOA

Song, Xinming, Xia, Yunfeng, He, Jianzong, Jia, Zhidong, Wang, Xilin

Journal:

The Journal of Engineering

Year:

2019

Language:

english

File:

PDF, 2.58 MB

english, 2019

11

3D-printed highly stable flexible strain sensor based on silver-coated-glass fiber-filled conductive silicon rubber

Zhao, Chen, Xia, Zhidong, Wang, Xuelong, Nie, Jingkai, Huang, Pei, Zhao, Shaofan

Journal:

Materials & Design

Year:

2020

File:

PDF, 2.07 MB

2020

12

Creep property of composite solders reinforced by nano-sized particles

Yaowu Shi, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2008

Language:

english

File:

PDF, 291 KB

english, 2008

13

Investigation of rare earth-doped BiAg high-temperature solders

Yaowu Shi, Weiping Fang, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2010

Language:

english

File:

PDF, 510 KB

english, 2010

14

Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions

Ning Zhang, Yaowu Shi, Fu Guo, Yongpei Lei, Zhidong Xia, Li Tian

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2010

Language:

english

File:

PDF, 830 KB

english, 2010

15

Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles

Tai, Feng, Guo, Fu, Liu, Jianping, Xia, Zhidong, Shi, Yaowu, Lei, Yongping, Li, Xiaoyan

Journal:

Soldering & Surface Mount Technology

Year:

2010

Language:

english

File:

PDF, 268 KB

english, 2010

16

Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles

Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 472 KB

english, 2010

17

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Galvanic corrosion of different metal substrates couples to Ni-C filled conductive silicon rubber

Zhou, Hu, Xia, Zhidong, Li, Zhe, Liu, Xiaohei, Guo, Fu

Year:

2011

Language:

english

File:

PDF, 2.51 MB

english, 2011

18

Self-Powered Piezoelectric and Thermoelectric Energy Simultaneous Extraction Interface Circuit Based on Double Stack Resonance

Wang, Xiudeng, Xia, Yinshui, Shi, Ge, Xia, Huakang, Ye, Yidie, Chen, Zhidong

Journal:

IEEE Transactions on Industrial Electronics

Year:

2019

Language:

english

File:

PDF, 1.62 MB

english, 2019

19

Systematic Review and Meta-Analysis of Drug-Eluting Balloon and Stent for Infrapopliteal Artery Revascularization

Zhang, Jianbin, Xu, Xiaojie, Kong, Jie, Xu, Rongwei, Fan, Xueqiang, Chen, Jie, Zheng, Xia, Ma, Bo, Sun, Mingsheng, Ye, Zhidong, Liu, Peng

Journal:

Vascular and Endovascular Surgery

Year:

2017

Language:

english

File:

PDF, 809 KB

english, 2017

20

Surgical treatment of recurrent varicose veins in the lower limbs associated with endovascular treatment of iliac vein stenosis

Kong, Jie, Liu, Peng, Li, Jinyong, Fan, Xueqiang, Wen, Jianyan, Zhang, Jianbin, Xu, Rongwei, Cui, Yiyao, Zhen, Xia, Ye, Zhidong

Journal:

International Journal of Surgery

Year:

2018

Language:

english

File:

PDF, 1.07 MB

english, 2018

21

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Wettability and Reliability Evaluation of Sn-9Zn solder on Cu Substrates Using Three Novel Soldering Fluxes

Xu, Dongxia, Lei, Yongping, Zhu, Lei, Xia, Zhidong, Guo, Fu, Shi, Yaowu

Year:

2007

Language:

english

File:

PDF, 4.05 MB

english, 2007

22

Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders

Ruihong Zhang, Ran Zhao, Fu Guo, Zhidong Xia

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.26 MB

english, 2009

23

Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test

Ning Zhang, Yaowu Shi, Fu Guo, Yongping Lei, Zhidong Xia, Zhenhua Chen, Li Tian

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2011

Language:

english

File:

PDF, 760 KB

english, 2011

24

Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy

Wenxing Dong, Yaowu Shi, Yongping Lei, Zhidong Xia, Fu Guo

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2009

Language:

english

File:

PDF, 712 KB

english, 2009

25

Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints

Guangdong Li, Yaowu Shi, Hu Hao, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2009

Language:

english

File:

PDF, 506 KB

english, 2009

26

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Study on reliability of room temperature vulcanization silicone rubber and conductive composite silicone rubber reinforced by silica

Zhao, Mengke, Xia, Zhidong, Zhu, Yongxin, Liu, Xiaohei, Guo, Fu

Year:

2011

Language:

english

File:

PDF, 271 KB

english, 2011

27

Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test

Ning Zhang, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Journal of Electronic Materials

Year:

2008

File:

PDF, 87 KB

2008

28

Principles and characteristics of vibration sparking in high voltage stator slots

Yinglai Xia,, Zhidong Jia,, Zhicheng Guan,, Liming Wang,, Zhengping Zhang,

Journal:

IEEE Transactions on Dielectrics and Electrical Insulation

Year:

2013

Language:

english

File:

PDF, 2.77 MB

english, 2013

29

Dissipative controller design for uncertain neutral systems with semi-Markovian jumping parameters

Xia, Weifeng, Xu, Shengyuan, Ma, Qian, Qi, Zhidong, Zhang, Zhengqiang

Journal:

Optimal Control Applications and Methods

Year:

2017

Language:

english

File:

PDF, 600 KB

english, 2017

30

A Self-Powered S-SSHI and SECE Hybrid Rectifier for PE Energy Harvesters: Analysis and Experiment

Xia, Huakang, Xia, Yinshui, Shi, Ge, Ye, Yidie, Wang, Xiudeng, Chen, Zhidong, Jiang, Qian

Journal:

IEEE Transactions on Power Electronics

Year:

2020

File:

PDF, 3.91 MB

2020

31

Effect of curing temperature on the properties of conductive silicone rubber filled with carbonyl permalloy powder

Wang, Xiaoya, Xia, Zhidong, Yuan, Bo, Zhou, Hu, Li, Zhe, Chen, Nannan

Journal:

Materials & Design

Year:

2013

Language:

english

File:

PDF, 1.59 MB

english, 2013

32

Investigations on the deformation mechanisms of single-crystalline Cu nanowires under bending and torsion

Tian, Xia, Cui, Junzhi, Zhang, Chaobo, Ma, Zhidong, Wan, Rui, Zhang, Qi

Journal:

Computational Materials Science

Year:

2014

Language:

english

File:

PDF, 2.23 MB

english, 2014

33

Simulation and partial discharge detection for typical defects of 10 kV cable the joint

Xia, Yunfeng, Song, Xinming, He, Jianzong, Jia, Zhidong, Wang, Xilin

Journal:

The Journal of Engineering

Year:

2019

File:

PDF, 3.05 MB

2019

34

[IEEE 2018 IEEE 2nd International Electrical and Energy Conference (CIEEC) - Beijing, China (2018.11.4-2018.11.6)] 2018 IEEE 2nd International Electrical and Energy Conference (CIEEC) - Research on the Influence of Consistent Arc on performance of Composite Insulators in Areas of high temperature and high humidity

YANG, Ting, WEI, Haikun, XIA, Yunfeng, ZHANG, Zhonghao, YANG, Changjian, WEI, Xinyu, XU, Chi, JIA, Zhidong

Year:

2018

Language:

english

File:

PDF, 1.65 MB

english, 2018

35

Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy

Hu Hao, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo

Journal:

Metallurgical and Materials Transactions A

Year:

2009

Language:

english

File:

PDF, 586 KB

english, 2009

36

Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls

Yang Yu, Zhidong Xia, Fu Guo, Yaowu Shi

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 556 KB

english, 2008

37

Self-Powered Piezoelectric and Thermoelectric Energy Simultaneous Extraction Interface Circuit Based on Double Stack Resonance

Wang, Xiudeng, Xia, Yinshui, Shi, Ge, Xia, Huakang, Ye, Yidie, Chen, Zhidong

Journal:

IEEE Transactions on Industrial Electronics

Year:

2019

File:

PDF, 1.62 MB

2019

38

A systems genetics study of swine illustrates mechanisms underlying human phenotypic traits

Zhu, Jun, Chen, Congying, Yang, Bin, Guo, Yuanmei, Ai, Huashui, Ren, Jun, Peng, Zhiyu, Tu, Zhidong, Yang, Xia, Meng, Qingying, Friend, Stephen, Huang, Lusheng

Journal:

Year:

2015

Language:

english

File:

PDF, 1.94 MB

english, 2015

39

Liposomal Vitamin D3 as an Anti-aging Agent for the Skin

Bi, Ye, Xia, Hongxi, Li, Lianlian, Lee, Robert J., Xie, Jing, Liu, Zongyu, Qiu, Zhidong, Teng, Lesheng

Journal:

Year:

2019

Language:

english

File:

PDF, 1.62 MB

english, 2019

40

Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test

Ning Zhang, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 832 KB

english, 2008

41

Properties of lead-free solder SnAgCu containing minute amounts of rare earth

Zhigang Chen, Yaowu Shi, Zhidong Xia, Yanfu Yan

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 850 KB

english, 2003

42

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Preparation and deposition process of Cu/Al powder in conductive polymer for EMI shielding

Zhang, Xing, Xia, Zhidong, Gao, Yong, Zhao, Shaofan

Year:

2011

Language:

english

File:

PDF, 3.15 MB

english, 2011

43

Research on antenna for detecting the corona discharge of transmission line

Xia, Yunfeng, Song, Xinming, Jia, Zhidong, Wang, Xilin, Qi, Jinfeng, Xu, Zheng

Journal:

The Journal of Engineering

Year:

2019

File:

PDF, 3.07 MB

2019

44

Integrative Analysis of a Cross-Loci Regulation Network Identifies App as a Gene Regulating Insulin Secretion from Pancreatic Islets

Tu, Zhidong, Keller, Mark P., Zhang, Chunsheng, Rabaglia, Mary E., Greenawalt, Danielle M., Yang, Xia, Wang, I-Ming, Dai, Hongyue, Bruss, Matthew D., Lum, Pek Y., Zhou, Yun-Ping, Kemp, Daniel M., Kend

Journal:

Year:

2012

Language:

english

File:

PDF, 1020 KB

english, 2012

45

SPIE Proceedings [SPIE Geoinformatics 2008 and Joint Conference on GIS and Built environment: Advanced Spatial Data Models and Analyses - Guangzhou, China (Saturday 28 June 2008)] Geoinformatics 2008 and Joint Conference on GIS and Built Environment: Advanced Spatial Data Models and Analyses - Geographic information system data sampling design and implementation

Jiang, Chengsheng, Liu, Lin, Li, Xia, Wang, Jinfeng, Hu, Maogui, Liu, Kai, Zhang, Xinchang, Li, Liangfa, Cao, Zhidong

Year:

2008

Language:

english

File:

PDF, 575 KB

english, 2008

46

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

Wenxing Dong, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 849 KB

english, 2008

47

Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint

Bo Li, Yaowu Shi, Yongping Lei, Fu Guo, Zhidong Xia, Bin Zong

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 1.02 MB

english, 2005

48

Study on Cu particles-enhanced SnPb composite solder

Yanfu Yan, Jianping Liu, Yaowu Shi, Zhidong Xia

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 379 KB

english, 2004

49

Incorporating Massive Scenarios in Transmission Expansion Planning with High Renewable Energy Penetration

Zhuo, Zhenyu, Du, Ershun, Zhang, Ning, Kang, Chongqing, Xia, Qing, Wang, Zhidong

Journal:

IEEE Transactions on Power Systems

Year:

2019

Language:

english

File:

PDF, 2.01 MB

english, 2019

50

Multi-Input SECE based on Buck Structure for Piezoelectric Energy Harvesting

Wang, Xiudeng, Xia, Yinshui, Du, Yingfei, Xia, Huakang, Shi, Ge, Ye, Yidie, Chen, Zhidong

Journal:

IEEE Transactions on Power Electronics

Year:

2020

File:

PDF, 1.10 MB

2020

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